SOM-COM-HPC-A-TGL-UP3 (C77)
Depending on the configuration and following revisions, the features of the board are subject to change. For detailed information on hardware specifications, please visit www.seco.com
SOM-COM-HPC-A-TGL-UP3 is a COM-HPC® Client module Size A with the 11th Gen Intel® Core™ and Celeron® processors. Combining speed, high-powered Intel® Iris® Xe Graphics, AI acceleration, and hardware support for real-time computing, it is ideal for demanding IoT applications.
For ordering purposes, the SOM-COM-HPC-A-TGL-UP3 is referred to by its base code, "C77".
Technical Documents
At the following Links you will find documentations like Manual and Rev. specific documents.
Manual
Datasheet
Documentation
For a complete explanation of Clea OS and detailed installation instructions, refer to the official documentation:
Download Clea OS Images
To quickly get started, download the latest complete prebuild Clea OS images (or other binaries like U-Boot, Linux Kernel, SDKs) from the official release page:
Build Clea OS
The source code for Clea OS can be found at the following Gitlab organization. To build a complete BSP image from source you can check the Get Started pages of the documentation. Created by Martina Bassi SECO Technical Resources · 14 May 2021
Downloads
Here you can find the latest version available:
| Category | Link |
|---|---|
| BIOS | C77_BIOS_1-05-02.7z |
| BIOS Tools | seco_tigerlake_bios-tools_1.01.00.7z |
| Driver WIN10 21H2 LTSC | seco_tigerlakeu_drivers_win2021_21h2.7z |
| Driver WIN11 24H2 LTSC | seco_tigerlake_drivers_win11_24h2_MR7.7z |
| EAPI | EAPI Wiki |