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DEV-KIT-COM-HPC-A

Kit

SECO DEV-KIT-COM-HPC-A is a cross-platform Development Kit designed to accelerate evaluation and development on both x86 and Arm® COM-HPC® Client modules. The kit is built around the CCHPC-C78-C carrier board and includes a starter bundle with GPIO header adapter cable, certified high-speed DP cable, DP to HDMI adapter, serial adapter cable, SATA cable, and front panel module with connecting cables. 

On the video, networking, and expansion stack, it provides 3x DP++ connectors, 1x 40-pin eDP/DSI connector, 2x CSI camera input connectors, 2x SATA connectors, 2x M.2 Key M slots for NVMe drives, 2x NBase-T Ethernet RJ-45 connectors, 2x 10Gbase-KR interfaces on OCP Type-C connector, 4x USB 4.0 / USB 3.2 Gen2x2 Type-C ports with PD functionality, 4x USB 2.0 host ports, 2x PCIe x4 slots, 2x PCIe x4 interfaces on the M.2 slots, and 2x PCIe x16 slots. 

The kit also integrates rich system interfaces for bring-up and prototyping, including I2S audio codec, line in, line out, mic in, multiple RS-232 / RS-422 / RS-485 ports, BMC connector, boot SPI header, GPIO, fan connector, POST code displays, smart battery connector, functional safety header, and ATX power inputs. It is delivered in ATX form factor, 305 x 244 mm, with industrial temperature support from -40°C to +85°C.

Technical Documents

At the following Links you will find documentations like Manual and Rev. specific documents.

Manual

[Manual] DEV-KIT-COMe-3.1-T6

Datasheet

[Datasheet] DEV-KIT-COMe-3.1-T6

Product page

DEV-KIT-COMe-3.1-T6