DEV-KIT-COMe-3.1-T6
SECO DEV-KIT-COMe-3.1-T6 is a cross-platform Development Kit designed to accelerate evaluation and development on both x86 and Arm® COM Express® Type 6 modules. Built around the COMe-T6-E10 carrier board, it includes a broad starter bundle with GPIO header adapter cable, 2 serial adapter cables, certified high-speed DP cable, DP to HDMI adapters, SATA cable, front panel module with connecting cable, HD audio and S/PDIF modules, USB debug cable, heat sink kit, power supply and ATX power cables, plus a microSD card. 
On the display and expansion stack, the kit provides 3x DP++ connectors or, as factory alternative, 1x DP++ plus 2x USB 4.0, alongside VGA, LVDS, and 4-lane eDP support. For storage and connectivity it exposes 4x SATA connectors, a microSD slot, 1x GbE RJ-45, 4x USB 3.2 host ports, 2x USB 2.0 host ports, 2x PCIe x4 Gen4 slots, and 1x PCIe x16 Gen4 slot, enabling a solid bring-up platform for prototyping and validation. 
The kit also integrates HD audio, S/PDIF, multiple serial interfaces including RS-232, RS-422 and RS-485, GPIO, SPI flash socket, I2C, SMBus, smart battery connector, POST code displays, JTAG, fan connector, and ATX-style power inputs. It is offered in ATX form factor, 305 x 244 mm, with commercial operating temperature from 0°C to +60°C.
Technical Documents
At the following Links you will find documentations like Manual and Rev. specific documents.